| xj | b04a402 | 2021-11-25 15:01:52 +0800 | [diff] [blame] | 1 | # |
| 2 | # Generic thermal sysfs drivers configuration |
| 3 | # |
| 4 | |
| 5 | menuconfig THERMAL |
| 6 | tristate "Generic Thermal sysfs driver" |
| 7 | help |
| 8 | Generic Thermal Sysfs driver offers a generic mechanism for |
| 9 | thermal management. Usually it's made up of one or more thermal |
| 10 | zone and cooling device. |
| 11 | Each thermal zone contains its own temperature, trip points, |
| 12 | cooling devices. |
| 13 | All platforms with ACPI thermal support can use this driver. |
| 14 | If you want this support, you should say Y or M here. |
| 15 | |
| 16 | if THERMAL |
| 17 | |
| 18 | config THERMAL_STATISTICS |
| 19 | bool "Thermal state transition statistics" |
| 20 | help |
| 21 | Export thermal state transition statistics information through sysfs. |
| 22 | |
| 23 | If in doubt, say N. |
| 24 | |
| 25 | config THERMAL_EMERGENCY_POWEROFF_DELAY_MS |
| 26 | int "Emergency poweroff delay in milli-seconds" |
| 27 | depends on THERMAL |
| 28 | default 0 |
| 29 | help |
| 30 | Thermal subsystem will issue a graceful shutdown when |
| 31 | critical temperatures are reached using orderly_poweroff(). In |
| 32 | case of failure of an orderly_poweroff(), the thermal emergency |
| 33 | poweroff kicks in after a delay has elapsed and shuts down the system. |
| 34 | This config is number of milliseconds to delay before emergency |
| 35 | poweroff kicks in. Similarly to the critical trip point, |
| 36 | the delay should be carefully profiled so as to give adequate |
| 37 | time for orderly_poweroff() to finish on regular execution. |
| 38 | If set to 0 emergency poweroff will not be supported. |
| 39 | |
| 40 | In doubt, leave as 0. |
| 41 | |
| 42 | config THERMAL_HWMON |
| 43 | bool |
| 44 | prompt "Expose thermal sensors as hwmon device" |
| 45 | depends on HWMON=y || HWMON=THERMAL |
| 46 | default y |
| 47 | help |
| 48 | In case a sensor is registered with the thermal |
| 49 | framework, this option will also register it |
| 50 | as a hwmon. The sensor will then have the common |
| 51 | hwmon sysfs interface. |
| 52 | |
| 53 | Say 'Y' here if you want all thermal sensors to |
| 54 | have hwmon sysfs interface too. |
| 55 | |
| 56 | config THERMAL_OF |
| 57 | bool |
| 58 | prompt "APIs to parse thermal data out of device tree" |
| 59 | depends on OF |
| 60 | default y |
| 61 | help |
| 62 | This options provides helpers to add the support to |
| 63 | read and parse thermal data definitions out of the |
| 64 | device tree blob. |
| 65 | |
| 66 | Say 'Y' here if you need to build thermal infrastructure |
| 67 | based on device tree. |
| 68 | |
| 69 | config THERMAL_WRITABLE_TRIPS |
| 70 | bool "Enable writable trip points" |
| 71 | help |
| 72 | This option allows the system integrator to choose whether |
| 73 | trip temperatures can be changed from userspace. The |
| 74 | writable trips need to be specified when setting up the |
| 75 | thermal zone but the choice here takes precedence. |
| 76 | |
| 77 | Say 'Y' here if you would like to allow userspace tools to |
| 78 | change trip temperatures. |
| 79 | |
| 80 | choice |
| 81 | prompt "Default Thermal governor" |
| 82 | default THERMAL_DEFAULT_GOV_STEP_WISE |
| 83 | help |
| 84 | This option sets which thermal governor shall be loaded at |
| 85 | startup. If in doubt, select 'step_wise'. |
| 86 | |
| 87 | config THERMAL_DEFAULT_GOV_STEP_WISE |
| 88 | bool "step_wise" |
| 89 | select THERMAL_GOV_STEP_WISE |
| 90 | help |
| 91 | Use the step_wise governor as default. This throttles the |
| 92 | devices one step at a time. |
| 93 | |
| 94 | config THERMAL_DEFAULT_GOV_FAIR_SHARE |
| 95 | bool "fair_share" |
| 96 | select THERMAL_GOV_FAIR_SHARE |
| 97 | help |
| 98 | Use the fair_share governor as default. This throttles the |
| 99 | devices based on their 'contribution' to a zone. The |
| 100 | contribution should be provided through platform data. |
| 101 | |
| 102 | config THERMAL_DEFAULT_GOV_USER_SPACE |
| 103 | bool "user_space" |
| 104 | select THERMAL_GOV_USER_SPACE |
| 105 | help |
| 106 | Select this if you want to let the user space manage the |
| 107 | platform thermals. |
| 108 | |
| 109 | config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR |
| 110 | bool "power_allocator" |
| 111 | select THERMAL_GOV_POWER_ALLOCATOR |
| 112 | help |
| 113 | Select this if you want to control temperature based on |
| 114 | system and device power allocation. This governor can only |
| 115 | operate on cooling devices that implement the power API. |
| 116 | |
| 117 | endchoice |
| 118 | |
| 119 | config THERMAL_GOV_FAIR_SHARE |
| 120 | bool "Fair-share thermal governor" |
| 121 | help |
| 122 | Enable this to manage platform thermals using fair-share governor. |
| 123 | |
| 124 | config THERMAL_GOV_STEP_WISE |
| 125 | bool "Step_wise thermal governor" |
| 126 | help |
| 127 | Enable this to manage platform thermals using a simple linear |
| 128 | governor. |
| 129 | |
| 130 | config THERMAL_GOV_BANG_BANG |
| 131 | bool "Bang Bang thermal governor" |
| 132 | default n |
| 133 | help |
| 134 | Enable this to manage platform thermals using bang bang governor. |
| 135 | |
| 136 | Say 'Y' here if you want to use two point temperature regulation |
| 137 | used for fans without throttling. Some fan drivers depend on this |
| 138 | governor to be enabled (e.g. acerhdf). |
| 139 | |
| 140 | config THERMAL_GOV_USER_SPACE |
| 141 | bool "User_space thermal governor" |
| 142 | help |
| 143 | Enable this to let the user space manage the platform thermals. |
| 144 | |
| 145 | config THERMAL_GOV_POWER_ALLOCATOR |
| 146 | bool "Power allocator thermal governor" |
| 147 | help |
| 148 | Enable this to manage platform thermals by dynamically |
| 149 | allocating and limiting power to devices. |
| 150 | |
| 151 | config CPU_THERMAL |
| 152 | bool "generic cpu cooling support" |
| 153 | depends on CPU_FREQ |
| 154 | depends on THERMAL_OF |
| 155 | help |
| 156 | This implements the generic cpu cooling mechanism through frequency |
| 157 | reduction. An ACPI version of this already exists |
| 158 | (drivers/acpi/processor_thermal.c). |
| 159 | This will be useful for platforms using the generic thermal interface |
| 160 | and not the ACPI interface. |
| 161 | |
| 162 | If you want this support, you should say Y here. |
| 163 | |
| 164 | config CLOCK_THERMAL |
| 165 | bool "Generic clock cooling support" |
| 166 | depends on COMMON_CLK |
| 167 | depends on PM_OPP |
| 168 | help |
| 169 | This entry implements the generic clock cooling mechanism through |
| 170 | frequency clipping. Typically used to cool off co-processors. The |
| 171 | device that is configured to use this cooling mechanism will be |
| 172 | controlled to reduce clock frequency whenever temperature is high. |
| 173 | |
| 174 | config DEVFREQ_THERMAL |
| 175 | bool "Generic device cooling support" |
| 176 | depends on PM_DEVFREQ |
| 177 | depends on PM_OPP |
| 178 | help |
| 179 | This implements the generic devfreq cooling mechanism through |
| 180 | frequency reduction for devices using devfreq. |
| 181 | |
| 182 | This will throttle the device by limiting the maximum allowed DVFS |
| 183 | frequency corresponding to the cooling level. |
| 184 | |
| 185 | In order to use the power extensions of the cooling device, |
| 186 | devfreq should use the simple_ondemand governor. |
| 187 | |
| 188 | If you want this support, you should say Y here. |
| 189 | |
| 190 | config THERMAL_EMULATION |
| 191 | bool "Thermal emulation mode support" |
| 192 | help |
| 193 | Enable this option to make a emul_temp sysfs node in thermal zone |
| 194 | directory to support temperature emulation. With emulation sysfs node, |
| 195 | user can manually input temperature and test the different trip |
| 196 | threshold behaviour for simulation purpose. |
| 197 | |
| 198 | WARNING: Be careful while enabling this option on production systems, |
| 199 | because userland can easily disable the thermal policy by simply |
| 200 | flooding this sysfs node with low temperature values. |
| 201 | |
| 202 | config HISI_THERMAL |
| 203 | tristate "Hisilicon thermal driver" |
| 204 | depends on ARCH_HISI || COMPILE_TEST |
| 205 | depends on HAS_IOMEM |
| 206 | depends on OF |
| 207 | default y |
| 208 | help |
| 209 | Enable this to plug hisilicon's thermal sensor driver into the Linux |
| 210 | thermal framework. cpufreq is used as the cooling device to throttle |
| 211 | CPUs when the passive trip is crossed. |
| 212 | |
| 213 | config IMX_THERMAL |
| 214 | tristate "Temperature sensor driver for Freescale i.MX SoCs" |
| 215 | depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST |
| 216 | depends on NVMEM || !NVMEM |
| 217 | depends on MFD_SYSCON |
| 218 | depends on OF |
| 219 | help |
| 220 | Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. |
| 221 | It supports one critical trip point and one passive trip point. The |
| 222 | cpufreq is used as the cooling device to throttle CPUs when the |
| 223 | passive trip is crossed. |
| 224 | |
| 225 | config MAX77620_THERMAL |
| 226 | tristate "Temperature sensor driver for Maxim MAX77620 PMIC" |
| 227 | depends on MFD_MAX77620 |
| 228 | depends on OF |
| 229 | help |
| 230 | Support for die junction temperature warning alarm for Maxim |
| 231 | Semiconductor PMIC MAX77620 device. Device generates two alarm |
| 232 | interrupts when PMIC die temperature cross the threshold of |
| 233 | 120 degC and 140 degC. |
| 234 | |
| 235 | config QORIQ_THERMAL |
| 236 | tristate "QorIQ Thermal Monitoring Unit" |
| 237 | depends on THERMAL_OF |
| 238 | depends on HAS_IOMEM |
| 239 | help |
| 240 | Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. |
| 241 | It supports one critical trip point and one passive trip point. The |
| 242 | cpufreq is used as the cooling device to throttle CPUs when the |
| 243 | passive trip is crossed. |
| 244 | |
| 245 | config SPEAR_THERMAL |
| 246 | tristate "SPEAr thermal sensor driver" |
| 247 | depends on PLAT_SPEAR || COMPILE_TEST |
| 248 | depends on HAS_IOMEM |
| 249 | depends on OF |
| 250 | help |
| 251 | Enable this to plug the SPEAr thermal sensor driver into the Linux |
| 252 | thermal framework. |
| 253 | |
| 254 | config ROCKCHIP_THERMAL |
| 255 | tristate "Rockchip thermal driver" |
| 256 | depends on ARCH_ROCKCHIP || COMPILE_TEST |
| 257 | depends on RESET_CONTROLLER |
| 258 | depends on HAS_IOMEM |
| 259 | help |
| 260 | Rockchip thermal driver provides support for Temperature sensor |
| 261 | ADC (TS-ADC) found on Rockchip SoCs. It supports one critical |
| 262 | trip point. Cpufreq is used as the cooling device and will throttle |
| 263 | CPUs when the Temperature crosses the passive trip point. |
| 264 | |
| 265 | config RCAR_THERMAL |
| 266 | tristate "Renesas R-Car thermal driver" |
| 267 | depends on ARCH_RENESAS || COMPILE_TEST |
| 268 | depends on HAS_IOMEM |
| 269 | help |
| 270 | Enable this to plug the R-Car thermal sensor driver into the Linux |
| 271 | thermal framework. |
| 272 | |
| 273 | config RCAR_GEN3_THERMAL |
| 274 | tristate "Renesas R-Car Gen3 thermal driver" |
| 275 | depends on ARCH_RENESAS || COMPILE_TEST |
| 276 | depends on HAS_IOMEM |
| 277 | depends on OF |
| 278 | help |
| 279 | Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux |
| 280 | thermal framework. |
| 281 | |
| 282 | config KIRKWOOD_THERMAL |
| 283 | tristate "Temperature sensor on Marvell Kirkwood SoCs" |
| 284 | depends on MACH_KIRKWOOD || COMPILE_TEST |
| 285 | depends on HAS_IOMEM |
| 286 | depends on OF |
| 287 | help |
| 288 | Support for the Kirkwood thermal sensor driver into the Linux thermal |
| 289 | framework. Only kirkwood 88F6282 and 88F6283 have this sensor. |
| 290 | |
| 291 | config DOVE_THERMAL |
| 292 | tristate "Temperature sensor on Marvell Dove SoCs" |
| 293 | depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST |
| 294 | depends on HAS_IOMEM |
| 295 | depends on OF |
| 296 | help |
| 297 | Support for the Dove thermal sensor driver in the Linux thermal |
| 298 | framework. |
| 299 | |
| 300 | config DB8500_THERMAL |
| 301 | tristate "DB8500 thermal management" |
| 302 | depends on MFD_DB8500_PRCMU |
| 303 | default y |
| 304 | help |
| 305 | Adds DB8500 thermal management implementation according to the thermal |
| 306 | management framework. A thermal zone with several trip points will be |
| 307 | created. Cooling devices can be bound to the trip points to cool this |
| 308 | thermal zone if trip points reached. |
| 309 | |
| 310 | config ARMADA_THERMAL |
| 311 | tristate "Marvell EBU Armada SoCs thermal management" |
| 312 | depends on ARCH_MVEBU || COMPILE_TEST |
| 313 | depends on HAS_IOMEM |
| 314 | depends on OF |
| 315 | help |
| 316 | Enable this option if you want to have support for thermal management |
| 317 | controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K). |
| 318 | |
| 319 | config DA9062_THERMAL |
| 320 | tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" |
| 321 | depends on MFD_DA9062 || COMPILE_TEST |
| 322 | depends on OF |
| 323 | help |
| 324 | Enable this for the Dialog Semiconductor thermal sensor driver. |
| 325 | This will report PMIC junction over-temperature for one thermal trip |
| 326 | zone. |
| 327 | Compatible with the DA9062 and DA9061 PMICs. |
| 328 | |
| 329 | config INTEL_POWERCLAMP |
| 330 | tristate "Intel PowerClamp idle injection driver" |
| 331 | depends on THERMAL |
| 332 | depends on X86 |
| 333 | depends on CPU_SUP_INTEL |
| 334 | help |
| 335 | Enable this to enable Intel PowerClamp idle injection driver. This |
| 336 | enforce idle time which results in more package C-state residency. The |
| 337 | user interface is exposed via generic thermal framework. |
| 338 | |
| 339 | config X86_PKG_TEMP_THERMAL |
| 340 | tristate "X86 package temperature thermal driver" |
| 341 | depends on X86_THERMAL_VECTOR |
| 342 | select THERMAL_GOV_USER_SPACE |
| 343 | select THERMAL_WRITABLE_TRIPS |
| 344 | default m |
| 345 | help |
| 346 | Enable this to register CPU digital sensor for package temperature as |
| 347 | thermal zone. Each package will have its own thermal zone. There are |
| 348 | two trip points which can be set by user to get notifications via thermal |
| 349 | notification methods. |
| 350 | |
| 351 | config INTEL_SOC_DTS_IOSF_CORE |
| 352 | tristate |
| 353 | depends on X86 && PCI |
| 354 | select IOSF_MBI |
| 355 | help |
| 356 | This is becoming a common feature for Intel SoCs to expose the additional |
| 357 | digital temperature sensors (DTSs) using side band interface (IOSF). This |
| 358 | implements the common set of helper functions to register, get temperature |
| 359 | and get/set thresholds on DTSs. |
| 360 | |
| 361 | config INTEL_SOC_DTS_THERMAL |
| 362 | tristate "Intel SoCs DTS thermal driver" |
| 363 | depends on X86 && PCI && ACPI |
| 364 | select INTEL_SOC_DTS_IOSF_CORE |
| 365 | select THERMAL_WRITABLE_TRIPS |
| 366 | help |
| 367 | Enable this to register Intel SoCs (e.g. Bay Trail) platform digital |
| 368 | temperature sensor (DTS). These SoCs have two additional DTSs in |
| 369 | addition to DTSs on CPU cores. Each DTS will be registered as a |
| 370 | thermal zone. There are two trip points. One of the trip point can |
| 371 | be set by user mode programs to get notifications via Linux thermal |
| 372 | notification methods.The other trip is a critical trip point, which |
| 373 | was set by the driver based on the TJ MAX temperature. |
| 374 | |
| 375 | config INTEL_QUARK_DTS_THERMAL |
| 376 | tristate "Intel Quark DTS thermal driver" |
| 377 | depends on X86_INTEL_QUARK |
| 378 | help |
| 379 | Enable this to register Intel Quark SoC (e.g. X1000) platform digital |
| 380 | temperature sensor (DTS). For X1000 SoC, it has one on-die DTS. |
| 381 | The DTS will be registered as a thermal zone. There are two trip points: |
| 382 | hot & critical. The critical trip point default value is set by |
| 383 | underlying BIOS/Firmware. |
| 384 | |
| 385 | menu "ACPI INT340X thermal drivers" |
| 386 | source drivers/thermal/int340x_thermal/Kconfig |
| 387 | endmenu |
| 388 | |
| 389 | config INTEL_BXT_PMIC_THERMAL |
| 390 | tristate "Intel Broxton PMIC thermal driver" |
| 391 | depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP |
| 392 | help |
| 393 | Select this driver for Intel Broxton PMIC with ADC channels monitoring |
| 394 | system temperature measurements and alerts. |
| 395 | This driver is used for monitoring the ADC channels of PMIC and handles |
| 396 | the alert trip point interrupts and notifies the thermal framework with |
| 397 | the trip point and temperature details of the zone. |
| 398 | |
| 399 | config INTEL_PCH_THERMAL |
| 400 | tristate "Intel PCH Thermal Reporting Driver" |
| 401 | depends on X86 && PCI |
| 402 | help |
| 403 | Enable this to support thermal reporting on certain intel PCHs. |
| 404 | Thermal reporting device will provide temperature reading, |
| 405 | programmable trip points and other information. |
| 406 | |
| 407 | menu "Mediatek thermal drivers" |
| 408 | depends on ARCH_MEDIATEK || COMPILE_TEST |
| 409 | source drivers/thermal/mediatek/Kconfig |
| 410 | endmenu |
| 411 | |
| 412 | menu "Broadcom thermal drivers" |
| 413 | depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || COMPILE_TEST |
| 414 | source "drivers/thermal/broadcom/Kconfig" |
| 415 | endmenu |
| 416 | |
| 417 | menu "Texas Instruments thermal drivers" |
| 418 | depends on ARCH_HAS_BANDGAP || COMPILE_TEST |
| 419 | depends on HAS_IOMEM |
| 420 | source "drivers/thermal/ti-soc-thermal/Kconfig" |
| 421 | endmenu |
| 422 | |
| 423 | menu "Samsung thermal drivers" |
| 424 | depends on ARCH_EXYNOS || COMPILE_TEST |
| 425 | source "drivers/thermal/samsung/Kconfig" |
| 426 | endmenu |
| 427 | |
| 428 | menu "STMicroelectronics thermal drivers" |
| 429 | depends on ARCH_STI && OF |
| 430 | source "drivers/thermal/st/Kconfig" |
| 431 | endmenu |
| 432 | |
| 433 | config TANGO_THERMAL |
| 434 | tristate "Tango thermal management" |
| 435 | depends on ARCH_TANGO || COMPILE_TEST |
| 436 | help |
| 437 | Enable the Tango thermal driver, which supports the primitive |
| 438 | temperature sensor embedded in Tango chips since the SMP8758. |
| 439 | This sensor only generates a 1-bit signal to indicate whether |
| 440 | the die temperature exceeds a programmable threshold. |
| 441 | |
| 442 | source "drivers/thermal/tegra/Kconfig" |
| 443 | |
| 444 | config QCOM_SPMI_TEMP_ALARM |
| 445 | tristate "Qualcomm SPMI PMIC Temperature Alarm" |
| 446 | depends on OF && SPMI && IIO |
| 447 | select REGMAP_SPMI |
| 448 | help |
| 449 | This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP) |
| 450 | PMIC devices. It shows up in sysfs as a thermal sensor with multiple |
| 451 | trip points. The temperature reported by the thermal sensor reflects the |
| 452 | real time die temperature if an ADC is present or an estimate of the |
| 453 | temperature based upon the over temperature stage value. |
| 454 | |
| 455 | config GENERIC_ADC_THERMAL |
| 456 | tristate "Generic ADC based thermal sensor" |
| 457 | depends on IIO |
| 458 | help |
| 459 | This enabled a thermal sysfs driver for the temperature sensor |
| 460 | which is connected to the General Purpose ADC. The ADC channel |
| 461 | is read via IIO framework and the channel information is provided |
| 462 | to this driver. This driver reports the temperature by reading ADC |
| 463 | channel and converts it to temperature based on lookup table. |
| 464 | |
| 465 | menu "Qualcomm thermal drivers" |
| 466 | depends on (ARCH_QCOM && OF) || COMPILE_TEST |
| 467 | source "drivers/thermal/qcom/Kconfig" |
| 468 | endmenu |
| 469 | |
| 470 | config ZX2967_THERMAL |
| 471 | tristate "Thermal sensors on zx2967 SoC" |
| 472 | depends on ARCH_ZX || COMPILE_TEST |
| 473 | help |
| 474 | Enable the zx2967 thermal sensors driver, which supports |
| 475 | the primitive temperature sensor embedded in zx2967 SoCs. |
| 476 | This sensor generates the real time die temperature. |
| 477 | |
| 478 | config UNIPHIER_THERMAL |
| 479 | tristate "Socionext UniPhier thermal driver" |
| 480 | depends on ARCH_UNIPHIER || COMPILE_TEST |
| 481 | depends on THERMAL_OF && MFD_SYSCON |
| 482 | help |
| 483 | Enable this to plug in UniPhier on-chip PVT thermal driver into the |
| 484 | thermal framework. The driver supports CPU thermal zone temperature |
| 485 | reporting and a couple of trip points. |
| 486 | endif |