| /***************************************************************************** |
| * Copyright Statement: |
| * -------------------- |
| * This software is protected by Copyright and the information contained |
| * herein is confidential. The software may not be copied and the information |
| * contained herein may not be used or disclosed except with the written |
| * permission of MediaTek Inc. (C) 2017 |
| * |
| * BY OPENING THIS FILE, BUYER HEREBY UNEQUIVOCALLY ACKNOWLEDGES AND AGREES |
| * THAT THE SOFTWARE/FIRMWARE AND ITS DOCUMENTATIONS ("MEDIATEK SOFTWARE") |
| * RECEIVED FROM MEDIATEK AND/OR ITS REPRESENTATIVES ARE PROVIDED TO BUYER ON |
| * AN "AS-IS" BASIS ONLY. MEDIATEK EXPRESSLY DISCLAIMS ANY AND ALL WARRANTIES, |
| * EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF |
| * MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT. |
| * NEITHER DOES MEDIATEK PROVIDE ANY WARRANTY WHATSOEVER WITH RESPECT TO THE |
| * SOFTWARE OF ANY THIRD PARTY WHICH MAY BE USED BY, INCORPORATED IN, OR |
| * SUPPLIED WITH THE MEDIATEK SOFTWARE, AND BUYER AGREES TO LOOK ONLY TO SUCH |
| * THIRD PARTY FOR ANY WARRANTY CLAIM RELATING THERETO. MEDIATEK SHALL ALSO |
| * NOT BE RESPONSIBLE FOR ANY MEDIATEK SOFTWARE RELEASES MADE TO BUYER'S |
| * SPECIFICATION OR TO CONFORM TO A PARTICULAR STANDARD OR OPEN FORUM. |
| * |
| * BUYER'S SOLE AND EXCLUSIVE REMEDY AND MEDIATEK'S ENTIRE AND CUMULATIVE |
| * LIABILITY WITH RESPECT TO THE MEDIATEK SOFTWARE RELEASED HEREUNDER WILL BE, |
| * AT MEDIATEK'S OPTION, TO REVISE OR REPLACE THE MEDIATEK SOFTWARE AT ISSUE, |
| * OR REFUND ANY SOFTWARE LICENSE FEES OR SERVICE CHARGE PAID BY BUYER TO |
| * MEDIATEK FOR SUCH MEDIATEK SOFTWARE AT ISSUE. |
| * |
| * THE TRANSACTION CONTEMPLATED HEREUNDER SHALL BE CONSTRUED IN ACCORDANCE |
| * WITH THE LAWS OF THE STATE OF CALIFORNIA, USA, EXCLUDING ITS CONFLICT OF |
| * LAWS PRINCIPLES. ANY DISPUTES, CONTROVERSIES OR CLAIMS ARISING THEREOF AND |
| * RELATED THERETO SHALL BE SETTLED BY ARBITRATION IN SAN FRANCISCO, CA, UNDER |
| * THE RULES OF THE INTERNATIONAL CHAMBER OF COMMERCE (ICC). |
| * |
| *****************************************************************************/ |
| |
| /******************************************************************************* |
| * |
| * Filename: |
| * --------- |
| * thermal_nvram_def.h |
| * |
| * Project: |
| * -------- |
| * VMOLY |
| * |
| * Description: |
| * ------------ |
| * Thermal NVRAM definition |
| * |
| * Author: |
| * ------- |
| * ------- |
| * |
| *============================================================================ |
| * HISTORY |
| * Below this line, this part is controlled by PVCS VM. DO NOT MODIFY!! |
| *------------------------------------------------------------------------------ |
| * removed! |
| * removed! |
| * removed! |
| * |
| * removed! |
| * removed! |
| * removed! |
| * removed! |
| * removed! |
| * removed! |
| * removed! |
| * removed! |
| *------------------------------------------------------------------------------ |
| * Upper this line, this part is controlled by PVCS VM. DO NOT MODIFY!! |
| *============================================================================ |
| ****************************************************************************/ |
| |
| #include "kal_general_types.h" |
| #include "thermal_public.h" |
| |
| #ifdef NVRAM_AUTO_GEN |
| #include "nvram_auto_gen.h" |
| #endif |
| #include "nvram_enums.h" |
| #include "nvram_defs.h" |
| |
| // LID Gorup Definition |
| #include "thermal_nvram_def.h" |
| |
| // Default Values |
| #if defined(__MD_TFWK__) && defined(__MTK_TARGET__) |
| nvram_thermal_sensor_info_struct const NVRAM_THERMAL_SENSOR_INFO_DEFAULT[NVRAM_EF_THERMAL_SENSOR_INFO_TOTAL] = |
| { |
| {THERMAL_LVTS_SENSOR_ID(0), -200, 1150, 9999, 1150, 50, 1, "SOC_On_Die"}, |
| {THERMAL_TIA_SENSOR_ID(0), -200, 1150, 9999, 9999, 30, 10, "PA_Group_2_NTC"}, |
| {THERMAL_TIA_SENSOR_ID(1), -200, 1150, 9999, 9999, 30, 10, "PA_Group_1_NTC"}, |
| {THERMAL_TIA_SENSOR_ID(2), -200, 1150, 9999, 9999, 30, 10, "RF_IC_NTC"}, |
| {THERMAL_TIA_SENSOR_ID(3), -200, 1150, 9999, 9999, 30, 10, "SOC_NTC"}, |
| }; |
| #endif |
| |
| // LID Declaration |
| ltable_entry_struct logical_data_item_table_thermal[] = |
| { |
| #if defined(__MD_TFWK__) && defined(__MTK_TARGET__) |
| { |
| NVRAM_EF_THERMAL_SENSOR_INFO_LID, |
| NVRAM_EF_THERMAL_SENSOR_INFO_TOTAL, |
| NVRAM_EF_THERMAL_SENSOR_INFO_SIZE, |
| NVRAM_NORMAL(NVRAM_THERMAL_SENSOR_INFO_DEFAULT), |
| NVRAM_CATEGORY_USER, |
| NVRAM_ATTR_AVERAGE | NVRAM_ATTR_MULTI_DEFAULT | NVRAM_ATTR_MULTIREC_READ | NVRAM_ATTR_OTA_RESET | NVRAM_ATTR_MCF_OTA, |
| "TH01", |
| VER(NVRAM_EF_THERMAL_SENSOR_INFO_LID) |
| }, |
| #endif |
| NVRAM_LTABLE_END |
| }; |